1. Material Grade: W1. 2. Tungsten purity: 99.95%. 3. Density: no less than 19.1g/cm3. 4. Size: 0.1mm~100mm thickness x 50-600mm width x 50-1000mm length. 5. Surface: Black, chemical cleaned or machined/ground. 6. Tungsten Sheets Feature: High melting point, High-density, high temperature oxidation resistance, long service life, resistance to corrosion, High quality, workability.
7. Applications of pure tungsten plate / tungsten sheet: Tungsten plate mainly used in manufacturing electric light source and electric vacuum parts, boats, heatshield and heat bodies in high temperature furnace , Medical diagnosis and treatment equipment ;as a means of high temperature heating element and high temperature structure parts; to product tungsten spiral for vacuum evaporation and making tungsten sputtering target. | Thickness | Width | Length |
| 0.05-0.15 | 100 | 200 |
| 0.15-0.20 | 205 | 1000 |
| 0.20-0.25 | 300 | 1000 |
| 0.25-0.30 | 330 | 1000 |
| 0.30-0.50 | 350 | 800 |
| 0.50-0.80 | 300 | 600 |
| 0.80-1.0 | 300 | 500 |
| 1.0-1.50 | 400 | 650 |
| 1.50-3.0 | 300 | 600 |
| >3.0 | 300 | L |
There is an increasing demand of tungsten material from the electronics, nuclear, and aerospace industries for materials that maintain reliability under ever-increasing temperature conditions. Because its properties meet these requirements, tungsten also is experiencing an increasing demand. Characteristics that support the demand for tungsten in many electronics applications are its: ● Strength and stiffness at high temperatures. ● Good thermal conductivity. ● Low thermal expansion. ● Low emissivity.
| Thickness | Width | Length |
| 3.0-4.0 | 250 | 400 |
| 4.0-6.0 | 300 | 600 |
| 6.0-8.0 | 300 | 800 |
| 8.0-10.0 | 300 | 750 |
| 10.0-14.0 | 200 | 650 |
| >14.0 | 200 | 500 |
Furnace parts, Semiconductor Base Plates, Components for Electron Tubes, Emission Cathodes for Electron Beam Evaporation, Cathodes and Anodes for Ion Implantation, Tubes / Boats for Sintering of Capacitors, Targets for X-ray Diagnostics, Crucibles, Heating Elements, X-ray Radiation Shielding, Sputtering Targets, Electrodes.